Glass-molded optical interposers for wafer scale photonic integrated circuit packaging in 800G modules and co-packaged optics

Ackermann, Manuel Franz; Shen, Bin; Merget, Florian; Wolz, Michael; Witzens, Jeremy

Bellingham, Washington, USA : SPIE (2022)
Contribution to a book, Contribution to a conference proceedings

In: Optical Interconnects XXII : 22-27 January 2022, San Francisco, California, United States : 20-24 February 2022, online / Ray T. Chen, Henning Schröder (editors) ; sponsored and published by: SPIE
Page(s)/Article-Nr.: 11 Seiten