Glass Molded Optical Interposers for Wafer Scale Datacom Component Packaging

Merget, Florian (Corresponding author); Ackermann, Manuel Franz; Shen, Bin; Saunders, G. D.; Haag, S.; Wolz, M.; Witzens, Jeremy

Piscataway, NJ] : IEEE (2021)
Contribution to a book, Contribution to a conference proceedings

In: 2021 European Conference on Optical Communication (ECOC) : 13-16 Sept. 2021

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