CDPP cleanroom

This space lists the technology and machines available in the IPH cleanroom in the Research Center for Digital Photonic Production (CDPP). This includes deposition (PECVD, PVD) and etching (RIE, ICP-RIE) tools as well as interconnecting/packaging systems (wire bonder, Flip-Chip bonder) and wet benches.

In any matters concerning the CDPP cleanroom, please contact the cleanroom manager.

DEPOSITION TOOLS

PVD sputtering tool

Manufacturer: Von Ardenne

Model: LS400S

Targets: SiO2, Ti, Al

Modes: DC and RF

Wafers: up to 6″

Process Gas: N2 or O2

IN OPERATION

 

PECVD

Manufacturer: Oxford Instruments

Model: PlasmaPro 100

Wafers: up to 8″

Processes: SiO2, SiN

 

ETCHING TOOLS

RIE

Manufacturer: Oxford Instruments

Model: PlasmaPro 100

Wafers: up to 8″

Process Gases: SiCl4, HBr, CF4, Ar, O2

Processes: Al etch, TiN etch, Si etch

 

ICP-RIE

Manufacturer: Oxford Instruments

Model: PlasmaPro 100 Cobra

Wafers: up to 8″

Process Gases: C4F8, SF6, CHF3, Ar, O2

Processes: SiO2 etch, Si cryogenic etch, Si mixed gas etch

 

PACKAGING TOOLS

WIRE BONDER
Manufacturer: HesseModel: BJ653

Bonding mode: wedge-wedge ultrasonic bonding

Bond wire: Al 

IN OPERATION

 

DIE-BONDER

Manufacturer: ASM Amicra

Model: Nano

Process Gase: N2

Processes modes: Bonding; Flip-Chip bonding

Bonding Processes: heated chuck, heated bondhead, laser bonding, UV unit

IN OPERATION

 

WET CHEMISTRY

WET BENCH RESIST COATING AND SOLVENTS
Equipment: spin coater (up to 4″), 2 hotplates, ultra sonic bath, sinkResists: AZ nLof 2070, AZ 5214 E

Solvents: Acetone, IPA, DMSO

Developers: AZ 726 MIF

IN OPERATION

 

WET BENCH ACIDS AND BASES
Acids: H2O2, H2SO4, HF (1%), HCl
Bases: NH4OH

IN OPERATION