CDPP cleanroom

The newly built photonics cleanroom in the CDPP (Center for Digital Photonic Production) is a facility providing fabrication tools to enable the production of photonic integrated circuits. The 200 m2 lab has been operational since 2020 and consists of a grey room (ISO 7) for packaging tools and vacuum machine backends as well as a cleanroom (ISO 5) for chip loading, wet chemistry and lithography. The equipment includes a PVD sputtering tool as well as a PECVD (Plasma Enhanced Chemical Vapor deposition) for high quality film deposition as well as both a Chlorine and a Fluorine based reactive ion etching tool (RIE) for dry etching. Packaging can be realized using the automated wire bonder or a fully image recognition controlled die bonder with flip-chip configuration. The tool set is completed by four wet benches for handling acids, bases, resists and solvents in order to clean, resist coat, develop or wet etch samples. Almost all tools are run in user mode, which means that researchers can get cleanroom and tool trainings to operate tools in close cooperation with the cleanroom staff to carry out their own fabrication goals. However, the focus of the cleanroom lays on PIC production in silicon photonics, optical coatings and high precision packaging for optics to electronics integration.

In any matters concerning the CDPP cleanroom, please contact the cleanroom manager.

DEPOSITION TOOLS

PVD sputtering tool

Manufacturer: Von Ardenne

Model: LS400S

Targets: SiO2, Ti, Al

Modes: DC and RF

Wafers: up to 6″

Process Gas: N2 or O2

IN OPERATION

 

PECVD

Manufacturer: Oxford Instruments

Model: PlasmaPro 100

Wafers: up to 8″

Processes: SiO2, SiN

IN OPERATION

 

ETCHING TOOLS

RIE

Manufacturer: Oxford Instruments

Model: PlasmaPro 100

Wafers: up to 8″

Process Gases: SiCl4, HBr, CF4, Ar, O2

Processes: Al etch, TiN etch, Si etch

 

ICP-RIE

Manufacturer: Oxford Instruments

Model: PlasmaPro 100 Cobra

Wafers: up to 8″

Process Gases: C4F8, SF6, CHF3, Ar, O2

Processes: SiO2 etch, Si cryogenic etch, Si mixed gas etch

 

PACKAGING TOOLS

WIRE BONDER
Manufacturer: HesseModel: BJ653Bonding mode: wedge-wedge ultrasonic bondingBond wire: Al 

IN OPERATION

 

DIE-BONDER

Manufacturer: ASM Amicra

Model: Nano

Process Gase: N2

Processes modes: Bonding; Flip-Chip bonding

Bonding Processes: heated chuck, heated bondhead, laser bonding, UV unit

IN OPERATION

 

WET CHEMISTRY

WET BENCH RESIST COATING AND SOLVENTS
Equipment: spin coater (up to 4″), 2 hotplates, ultra sonic bath, sinkResists: AZ nLof 2070, AZ 5214 ESolvents: Acetone, IPA, DMSO

Developers: AZ 726 MIF

IN OPERATION

 

WET BENCH ACIDS AND BASES
Acids: H2O2, H2SO4, HF (1%), HCl
Bases: NH4OHIN OPERATION